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2026-09-15 Daily Brief | Hilo Research

Summary

The current market is jointly driven by the structural expansion of AI infrastructure capital expenditure and the repricing of macro interest rate risks. Hyperscaler capex continues to be revised upward, driving significant supply-demand gaps in copper-clad laminates (CCL), high-end fiberglass cloth, HVLP copper foil, and optical interconnect components, ushering in a volume-and-price upcycle for upstream material suppliers; meanwhile, disorderly rising bond yields have replaced the AI bubble as the primary tail risk, with investors shifting from equities and real estate to cash and defensive sectors. China's real estate market faces deteriorating profit models due to pre-sale fund supervision policies, while companies with recurring revenue demonstrate greater resilience. On the consumer side, demand across China's beer industry has slowed comprehensively but leading players' market shares remain solid, while the cruise industry is squeezed by weakening European pricing and soaring fuel costs. In enterprise software, AI agents are deepening rather than eroding the moats of core business systems, driving a revaluation of tracks such as identity governance and ERP.

2026-09-1531 reports7 institutions
Published: Content updated:
01

AI Infrastructure Materials Super Cycle: CCL, PCB, Fiberglass Cloth, and Copper Foil

3 Related reports

Key views

Morgan Stanley expects the global CCL TAM to grow from 190 hundred million USD in 2025 to 470 hundred million USD in 2030 (compound annual growth rate of 20%), higher than market expectations of 350 hundred million to 400 hundred million USD; meanwhile, the global PCB TAM will rise from 580 hundred million USD to 1350 hundred million USD, with AI/data center PCB demand growing more than six-fold to 860 hundred million USD, reaching a compound annual growth rate of 45%. Increased material usage per system contributed 84% to AI-related CCL growth, such as Nvidia VR300 single-rack CCL usage expected to rise to 35,601 USD.

The HVLP4 copper foil market is expected to surge from less than 5000 ten thousand USD in 2025 to 28 hundred million USD in 2030, with bottom-up models showing supply gaps of 31% and 20% in 2027 and 2028, respectively. Mitsui Kinzoku holds 41% of global HVLP4 capacity for 2026 years, while Co-Tech Development, as the fastest follower, is shifting capacity towards advanced RTF and HVLP products. Specialized equipment and low yields limit effective capacity, granting qualified suppliers strong pricing power in 2027-28.

High-end electronic-grade fiberglass cloth is listed as the most attractive material opportunity, with a projected supply gap of approximately 40% in 2026, further worsening in 2027, and easing to about 30% in 2028. Limited loom supply, tight glass roving, and rising precious metal costs constrain qualified capacity expansion. Nittobo holds approximately 90% of the T-glass market share, while Honghe Technology is becoming one of the few domestic manufacturers capable of scaling high-end electronic cloth supply by shifting capacity to special grades.

Grace Fabric's new Huangshi project plans to add approximately 1.5 hundred million meters of high-end fiberglass cloth and approximately 1254 tons of special yarn annual design capacity, targeting completion in 2027. The company's special fiberglass cloth share of annual shipments is expected to rise from 2.6% in 2025 to approximately 16% in 2028, contributing over 50% to revenue. It maintains partnerships exceeding ten years with all five major customers, and four leading global end-customers have signed agreements and paid deposits to lock in two-to-three-year capacity. Through the Huangshi yarn project, it can achieve 100% self-sufficiency in AI-related fiberglass cloth and 70% self-sufficiency in E-glass fiberglass cloth. Morgan Stanley assigns a target price of Rmb 170 and an Overweight rating based on 45 times 2028 forward P/E.

Among CCL suppliers, EMC was first rated Overweight, with a target price of NT$ 8,400 corresponding to 20 times CY28 P/E, expecting gross margins to rise from 29.8% in 2025 to 41.4% in 2028. TUC was also first rated Overweight with a target price of NT$ 2,700; its lower valuation reflects its relative lag in high-end positioning. Kingboard Laminates was first rated Overweight due to vertical integration advantages, but its high proportion of ordinary FR-4 makes it more cyclical. Co-Tech is positioned as a key second source for HVLP4 and was first rated Overweight, with gross margins expected to rise significantly from 21.8% in 2025 to 47.2% in 2028. Shengyi Technology remains Equal-weight, with the target price raised to Rmb 170.

The Rubin VR200 NVL72 rack is estimated to contain approximately 570,000 MLCCs, nearly 80% higher than the GB300 rack, driving an expected increase in dollar content per rack of 182%. Faster transmission drives the CCL sector to shift from traditional epoxy resins to PPE/OPE, BMI, and cyanate ester systems, making Mitsubishi Gas Chemical and Denka preferred resin exposures.

The AI materials group has pulled back approximately 36% from its highs after rising 91% in the previous 12 months, currently trading at approximately 26 times 2026 forward P/E, compared to approximately 35 times for PCB/CCL peers, indicating room for revaluation of upstream material suppliers relative to downstream counterparts.

Current market environment

Generational shifts in AI server platforms (such as the Nvidia Rubin architecture) have caused a surge in material value per rack, coupled with continuous upward revisions to hyperscaler capex, resulting in severe mismatches between nominal capacity and certified qualified capacity for key upstream materials like CCL, high-end fiberglass cloth, and HVLP copper foil. Major customer certification for M7 and above high-grade CCL typically requires 12 to 18 months, and long certification cycles create design-in stickiness for existing suppliers.

Future market changes

Supply-demand gaps in high-end fiberglass cloth and HVLP copper foil peak in 2027 before gradually easing

Medium term

Triggers

  • AI server shipment ramp-up proceeds as expected
  • New expanded capacity (such as Grace Fabric's Huangshi project) comes online on schedule in 2027

Transmission channels

  • Release of new capacity increases qualified supply
  • Narrowing supply-demand gap limits further price increases
  • Supplier margins stabilize at high levels or decline slightly

Indicators to watch

  • Quarterly shipment data meets expectations
  • Spot and contract price increases slow down

Invalidation conditions

  • Severe delays in capacity ramp-up
  • Unexpected sharp cut in AI capital expenditure

PTFE-based CCL or co-packaged optics (CPO) changes long-term material demand structure

Long term

Triggers

  • PTFE processing challenges are overcome or CPO technology achieves large-scale commercial use in major data centers

Transmission channels

  • PTFE replaces some M9 solutions or CPO reduces electrical PCB interconnect demand
  • Growth logic for traditional high-end CCL and PCB usage is weakened
  • Existing leaders face a shrinking addressable market if they do not master new technologies

Indicators to watch

  • Leading cloud vendors release new generation architecture specifications based on PTFE or CPO

Invalidation conditions

  • Hybrid PTFE/M9 solutions dominate long-term or CPO commercialization progress falls far short of expectations

Institutional disagreements

Prospects for high-end breakthroughs by mainland China CCL suppliers

Different views

  • Morgan Stanley believes Shengyi Technology is likely to gain share in the AI server CCL market but maintains an Equal-weight rating, noting that current valuations are reasonable and there are risks from US-China trade tensions
  • If PTFE-based CCL is adopted, Shengyi Technology may benefit, while EMC's addressable market may shrink if it needs to procure PTFE externally, reflecting divergent views on the competitiveness of mainland China and Taiwan suppliers under different technology routes

Opportunities and risks

Domestic substitution and capacity locking for high-end electronic-grade fiberglass cloth

Emerging opportunity

A supply gap of 40% is expected in 2027, and major customers need to pay deposits in advance to lock in capacity, granting early expanders extremely strong bargaining power.

Potential beneficiaries

  • Grace Fabric
  • Honghe Technology

Risks

  • Capacity ramp-up delays
  • Rising raw material costs
  • Slowing AI investment

Indicators to watch

  • Increased share of special fiberglass cloth shipments
  • Expansion of prepayment contract scale

Share acquisition as second supplier for HVLP4 copper foil

Emerging opportunity

Mitsui Kinzoku dominates but capacity is limited; supply gaps in 2027-2028 grant qualified second suppliers strong pricing power.

Potential beneficiaries

  • Co-Tech Development

Risks

  • Yield improvement falls short of expectations
  • Customer certification failure

Indicators to watch

  • Passing certification by top CCL manufacturers
  • Gross margin climbing above 40%
Related reports(3)

This content is compiled based on institutional research report views, for research reference only, and does not constitute investment advice.

Zhejiang ICP No. 2022035445-5
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