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Hong Kong investors focus on beneficiaries of the AMD server chain, substrates, and CCL supply tightness

Institution
Bank of America / BofA Securities
Date
2026-05-25
Authors
Mike Yang, Haas Liu, Cathy Hsu
Company
-
Ticker
AMD.US
Industry
Semiconductors; PCB; Computer Hardware; Information Technology Services; Copper
Rating
-
NeutralLow confidenceThe report is constructive on directions benefiting from AMD server supply chain, test interfaces, ABF substrates, high-end CCL, and some power semiconductor supply tightness, while also highlighting pressure from test interface valuations, PCB competitive dynamics, and CPO adoption.
AuthorsMike Yang, Haas Liu, Cathy Hsu
Business segmentsAMD server supply chain、server CPU、test interfaces、ABF substrates、PCB、CCL、power semiconductors、PC fabless supply chain
Research firm divisions/subsidiariesBank of America(Other)、BofA Securities(Other)

AI summary card

Hong Kong investors focus on beneficiaries of the AMD server chain, substrates, and CCL supply tightness

After meeting about 30 investors in Hong Kong from May 18 to 21, BofA Securities concluded that the market's core questions centered on beneficiaries of the AMD server supply chain, the match between valuation and earnings growth, the ranking of hardware materials, and the persistence of supply shortages.

The industry view is selectively constructive; the report did not provide a single-company rating, target price, or current price.
Taiwan TechnologyAMD server supply chainData CenterSemiconductorsABF substratesCCLtest interfacessupply tightness
  • Investors were most focused on beneficiaries of the AMD server supply chain and names exposed to stronger server CPU demand, with the report citing relatively high-exposure companies such as Aspeed, MPI, TUC, Unimicron, NYPCB, and Kinsus.
  • For test interface companies such as MPI and WinWay, investors worried about strong share prices and valuation levels after years of rerating; the report emphasized that earnings delivery or beats over the next several quarters to years could continue to support the stocks.
  • In terms of hardware materials ranking, the report was relatively more positive on ABF substrates and high-end CCL because their supply tightness is expected to last longer; PCB faces a more fragmented competitive landscape and the impact of CPO adoption.
  • On supply shortages, test interfaces and power semiconductors were flagged as subsectors with more pronounced new supply tightness due to longer delivery lead times.
  • Within the PC fabless chain, the report was relatively more constructive on ASMedia than Parade, because Parade may not enter AMD-aligned ASIC-like business supply chains until as early as 2H27.

Report interpretation

Overview

This report is BofA Securities' feedback summary following its Taiwan technology sector marketing efforts in Hong Kong. The analysts met with about 30 investors in Hong Kong from May 18 to 21, 2026, and mainly discussed the AMD server supply chain, server CPU demand, test interface valuations, the ranking of hardware substrates/PCB/CCL, supply shortages, and preferences within the PC fabless supply chain. The report is not a full financial model update for any single company; rather, it is an industry allocation and subsector observation built from investor Q&A.

Core views

The core view is: first, the AMD server supply chain and stronger server CPU demand remain the main focus of investors, with high-exposure companies such as Aspeed, MPI, TUC, Unimicron, NYPCB, and Kinsus specifically named; second, valuation for test interface companies remains debatable, but earnings visibility and potential beats may continue to serve as share price catalysts; third, ABF substrates and high-end CCL are more attractive than PCB because supply tightness is expected to persist longer; fourth, longer lead times for test interfaces and power semiconductors indicate new supply constraints; and fifth, within the PC fabless direction, ASMedia is preferred over Parade.

Analysis framework

The report uses a Hong Kong roadshow feedback synthesis approach, organizing the high-frequency questions from roughly 30 investors by theme and combining them with the analysts' judgment on server CPU demand, AMD supply chain exposure, material supply and demand, valuation and earnings growth, and the timetable for PC fabless companies entering the supply chain to form a subsector preference ranking.

Methodology notes

  • Industry roadshow feedbackInvestor Q&A synthesis

    Convert investors' high-frequency questions during the roadshow into industry focus areas

    The report is not a systematic financial forecast update; instead, it summarizes the questions investors raised during the Hong Kong marketing period around the AMD server chain, valuation, supply shortages, and the PC supply chain, and provides the analysts' responses.

  • Supply chain exposure analysisIdentification of beneficiaries from server CPU and AMD supply chain

    Judge beneficiary strength by companies' exposure to server controllers, probe cards, substrates, and related materials

    The report names companies such as Aspeed, MPI, TUC, Unimicron, NYPCB, and Kinsus because they have relatively high exposure to the AMD server supply chain or stronger server CPU demand.

  • Supply-demand cycle analysisSupply tightness and lead-time observation

    Use delivery lead times and shortage duration to judge subsector momentum

    ABF substrates and high-end CCL are viewed as having more persistent shortages, while test interfaces and power semiconductors are also marked as supply-tight directions because lead times are longer.

Asset mapping & comparison

Structured mapping from thesis to named assets (strengths, weaknesses, peers, risks).

  • AMD.US
    Demand and supply chain main theme
    Strengths
    Stronger server CPU demand and the expansion of AMD-aligned supply chains have increased attention on Taiwan's technology chain.
    Weaknesses
    The report focuses on supply chain beneficiaries rather than issuing a rating or target price update directly on AMD.
    Comparison
    Companies with high exposure to AMD-related supply chains are relatively more closely watched by investors.
    Risks
    Server demand falls short of expectations, supply chain entry is delayed, or the market has already priced in the good news.
  • Aspeed
    Potential beneficiary of the AMD server supply chain
    Strengths
    Higher exposure to server controllers; flagged by the report as a beneficiary direction.
    Weaknesses
    The report did not provide specific valuation or earnings forecast data.
    Comparison
    Grouped with other supply chain companies in the AMD server chain high-exposure list.
    Risks
    Fluctuations in server demand and changes in customer order pacing.
  • MPI
    Beneficiary of test interfaces and probe cards
    Strengths
    May benefit from demand spillover and share gain; earnings visibility was emphasized.
    Weaknesses
    Investors worry about valuation because the stock has performed strongly and rerated over the past several years.
    Comparison
    Discussed alongside WinWay in the test interface segment.
    Risks
    Insufficient valuation digestion, weaker-than-expected demand spillover, or easing lead-time constraints.
  • WinWay
    Test interface company
    Strengths
    The test interface segment is supported by server demand and supply tightness.
    Weaknesses
    It also faces concerns about elevated valuations and limited upside after rerating.
    Comparison
    Together with MPI, it was one of the names investors asked about in relation to valuation and earnings growth.
    Risks
    Earnings miss expectations or valuation multiples compress.
  • Unimicron
    Beneficiary in the substrate supply chain
    Strengths
    As a substrate name, it was singled out as benefiting from ABF substrate supply tightness.
    Weaknesses
    The report did not disclose separate company-level financial forecasts.
    Comparison
    Along with NYPCB and Kinsus, it belongs to the substrate-related beneficiary list.
    Risks
    ABF shortages ease, capacity expands too quickly, or demand becomes volatile.
  • NYPCB
    Substrate/PCB-related beneficiary
    Strengths
    Listed as one of the companies with relatively high exposure to the AMD server chain.
    Weaknesses
    The PCB sector overall faces a more fragmented competitive landscape and the impact of CPO adoption.
    Comparison
    Within the substrate and PCB chain, it is important to distinguish high-end substrate beneficiaries from ordinary PCB pressure.
    Risks
    Rising competition, CPO substitution effects, and supply-demand improvement.
  • Kinsus
    Beneficiary in the substrate supply chain
    Strengths
    Included in the report among substrate-related high-exposure names.
    Weaknesses
    Lacks separate valuation and earnings forecast support.
    Comparison
    Shares the substrate beneficiary framework with Unimicron and NYPCB.
    Risks
    Changes in customer demand and capacity cycle risks.
  • TUC
    Beneficiary in the CCL/materials chain
    Strengths
    High-end CCL supply remains tight, and the report is relatively more positive on CCL names.
    Weaknesses
    Changes in material prices and capacity may affect earnings flexibility.
    Comparison
    Relative to PCB, CCL is viewed as having a better supply-demand structure.
    Risks
    Supply tightness eases, raw material volatility, and slower downstream demand.
  • ASMedia
    PC fabless supply chain
    Strengths
    The report is relatively more positive on ASMedia and views it as more attractive than Parade.
    Weaknesses
    The overall PC fabless direction still calls for caution.
    Comparison
    Compared with Parade, ASMedia is preferred in terms of timing and supply chain positioning.
    Risks
    Weak PC demand, delayed product cycles, or intensifying competition.
  • Parade
    PC fabless supply chain
    Strengths
    It still attracts investor attention and has potential opportunities in AMD-aligned ASIC-like business.
    Weaknesses
    The report believes it may not enter AMD-related supply chains until as early as 2H27.
    Comparison
    The report is more cautious relative to ASMedia.
    Risks
    Supply chain entry is delayed, business validation falls short of expectations, or PC demand weakens.

Key data

  • Roadshow location and datesHong Kong, 2026-05-18 to 2026-05-21The report says meetings were held with about 30 investors during this period.
  • Number of investor meetingsAbout 30 investorsUsed to summarize the Hong Kong marketing feedback.
  • AMD server chain beneficiariesAspeed, MPI, TUC, Unimicron, NYPCB, KinsusThe report says these companies have relatively higher exposure.
  • Hardware materials rated more positivelyABF substrates, high-end CCLThe reason is that supply tightness or shortages are expected to last longer.
  • Main pressure on PCBMore fragmented competitive landscape, impact from CPO adoptionThe report is therefore relatively cautious on PCB.
  • New supply-tight directionsTest interfaces, power semiconductorsBased on longer product delivery lead times.
  • PC fabless preferenceASMedia is relatively better than ParadeParade may not enter AMD-aligned ASIC-like business supply chains until as early as 2H27.

Impact & implications

For portfolios, the report suggests that opportunities within Taiwan technology are not evenly distributed; instead, investors should prioritize companies with higher exposure to AMD server CPUs, test interfaces, ABF substrates, high-end CCL, and some power semiconductors. The test interface sector, which has already rerated, will need future earnings delivery or beats to absorb the valuation; PCB requires greater caution because of competition and CPO technology changes. Opportunities in the PC fabless chain are more medium- to long-term, and the timing differences in when companies enter AMD-related businesses will affect relative attractiveness.

Risks

  • For test interface companies, the strong share price performance and multi-year rerating have raised debate about whether valuation matches future earnings growth.
  • The PCB sector has a more fragmented competitive landscape and may be negatively affected by CPO adoption.
  • If supply tightness in ABF substrates, high-end CCL, test interfaces, and power semiconductors eases, the related beneficiary logic could weaken.
  • If server CPU and AMD supply chain demand falls short of expectations, earnings visibility for high-exposure companies may decline.
  • The timing for PC fabless companies such as Parade to enter AMD-aligned ASIC-like business supply chains may be later than expected.
  • The report contains general investment disclosures and conflict-of-interest disclosures; investors should treat it as one factor rather than as the sole investment basis.

What to watch

  • Whether stronger AMD server CPU demand continues and whether it passes through to Taiwan's server controller, probe card, substrate, and material supply chains.
  • Whether earnings over the next several quarters for MPI, WinWay, and similar test interface companies meet or exceed market expectations.
  • Lead times, pricing, and the pace of new capacity release for ABF substrates and high-end CCL.
  • The actual magnitude of the impact on PCB from CPO adoption and intensifying competition.
  • Whether delivery lead times for power semiconductors and test interface products continue to lengthen.
  • The pace of supply chain entry for ASMedia and Parade in AMD-aligned or ASIC-like businesses, especially the changes around 2H27.
Zhejiang ICP No. 2022035445-5
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