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J.P. Morgan raises Winbond target price to NT$255, betting on a longer memory upcycle

Institution
J.P. Morgan
Date
2026-06-14
Authors
Jimmy Huang, Gokul Hariharan
Company
Winbond
Ticker
2344.TW
Industry
Semiconductor Memory
Rating
Overweight
BullishLow confidenceThe report believes the DRAM/NAND upcycle will be stronger and last longer, and that Winbond will benefit from improving traditional DRAM supply-demand dynamics, LTA lock-ins, server demand, rising flash market share, and improved profitability, while the market underestimates its EPS potential.
AuthorsJimmy Huang, Gokul Hariharan
Target priceNT$255.00
Business segmentsDRAM、SLC NAND flash、NOR flash、CUBE edge AI 3D DRAM
Research firm divisions/subsidiariesJ.P. Morgan(Other)

AI summary card

J.P. Morgan raises Winbond target price to NT$255, betting on a longer memory upcycle

The report maintains an Overweight rating on Winbond, believing that the DRAM/NAND upcycle, LTAs and customized DRAM, as well as rising SLC NAND/NOR flash market share will drive revenue and profit expansion.

Rating: Overweight; Current price: NT$172.00; Target price: NT$255.00; Implied upside: about 48.3%.
Company ResearchSemiconductor MemoryDRAMSLC NANDNOR flashTarget Price IncreaseOverweight
  • The Dec-26 target price is raised from NT$173 to NT$255, based on 3.0x 2027E P/B, equivalent to 5.9x 2027E P/E.
  • J.P. Morgan expects the global DRAM undersupply rate to be 6%/11%/13% in 2026/2027/2028, benefiting traditional DRAM makers such as Winbond.
  • Winbond 2026E/2027E EPS is forecast at NT$25.4/NT$43.2, respectively, 38%/45% above Bloomberg consensus.
  • For the flash business, the report expects 2025-2027 revenue CAGR of 99%; Winbond is already No.1 globally in NOR flash and is aiming to become No.1 globally in SLC NAND.

Report interpretation

Overview

This report is a company research and outlook update by J.P. Morgan on Winbond (2344.TW). The analysts maintain a positive view on the company, believing that a higher and longer DRAM/NAND upcycle will materially benefit Winbond, especially its traditional DRAM, SLC NAND, and NOR flash businesses. The report raises the Dec-26 target price to NT$255 and maintains the Overweight rating.

Core views

The core views include: first, the widening global DRAM supply-demand gap, with major memory makers continuing to reduce DDR4 supply, benefiting niche and traditional DRAM makers such as Winbond; second, Winbond is reducing cyclicality and improving visibility through capacity upgrades, expansion plans, server-related demand, long-term agreements, and customized DRAM; third, improving supply dynamics in SLC NAND and NOR flash should allow Winbond to improve profitability through capacity expansion, market share gains, and price increases; fourth, the market may be underestimating the company's EPS potential for 2026-2027.

Analysis framework

The report uses upward revisions to company earnings forecasts, industry supply-demand analysis, segment revenue and gross profit structure forecasts, market share analysis, and a relative valuation framework. For valuation, the target price is based on 3.0x 2027E P/B, cross-referenced with its implied 5.9x 2027E P/E.

Methodology notes

  • Valuation methodsP/B valuation method

    The target price is derived by multiplying 2027E book value per share by the target P/B multiple.

    J.P. Morgan sets Winbond's Dec-26 target price at NT$255, based on 3.0x 2027E P/B, corresponding to 5.9x 2027E P/E.

  • Industry Supply and DemandDRAM supply-demand gap analysis

    Price and capacity utilization trends are assessed by forecasting the industry's undersupply rate.

    The report cites forecasts from the global memory team that DRAM undersupply rates will be 6%/11%/13% in 2026/2027/2028, supporting improved fundamentals for traditional DRAM makers.

  • Earnings ForecastEPS upward revision and consensus comparison

    Differences between analyst forecasts and market consensus are compared to identify market expectation gaps.

    The report raises 2026E/2027E EPS by 16%/55% to NT$25.4/NT$43.2, respectively, 38%/45% above Bloomberg consensus.

Asset mapping & comparison

Structured mapping from thesis to named assets (strengths, weaknesses, peers, risks).

  • Winbond (2344.TW)
    Core covered name
    Strengths
    Benefits from the traditional DRAM upcycle, LTA lock-ins, server demand, capacity upgrades, global leadership in NOR flash, and SLC NAND expansion.
    Weaknesses
    The business remains exposed to memory cycle volatility, and some growth depends on ramp-up of new capacity, new products, and the CUBE business.
    Comparison
    The report believes its 2026E/2027E EPS is 38%/45% above Bloomberg consensus, indicating the market may be underestimating its earnings power.
    Risks
    Traditional consumer DRAM prices and demand may fall short of expectations; SLC NAND and NOR flash prices or demand may weaken; the CUBE business may ramp more slowly than expected.
  • DRAM
    Main growth driver
    Strengths
    Widening undersupply, shrinking DDR4 supply, and strong demand from servers and long-lifecycle applications.
    Weaknesses
    Still cyclical, and profitability would be affected if prices and demand come in below expectations.
    Comparison
    The report forecasts Winbond DRAM revenue at NT$156bn in 2026 and NT$239bn in 2027, contributing 60% of revenue and 66% of gross profit in 2027.
    Risks
    Traditional consumer DRAM contract prices and demand in 4Q25-2Q26 may be weaker than expected.
  • SLC NAND and NOR flash
    Source of market share gains and profitability improvement
    Strengths
    No.1 globally in NOR flash, with potential share gains in SLC NAND; prices supported by supply exits, AI servers, automotive, and server demand.
    Weaknesses
    Capacity expansion and market share gains require successful execution.
    Comparison
    The report expects 2025-2027 flash revenue CAGR of 99%, with SLC NAND gross margin of 70-80% and NOR flash gross margin of 55-60% in 2026-2027.
    Risks
    SLC NAND and NOR flash price and demand trends may be weaker than expected.

Key data

  • Current share priceNT$172.00Price date is June 12, 2026.
  • Target priceNT$255.00Dec-26 target price; previous target price was Jun-26 NT$173.00.
  • RatingOverweightJ.P. Morgan maintains an Overweight rating.
  • Global DRAM undersupply rate forecast6%/11%/13% in 2026/2027/2028From forecasts by J.P. Morgan's global memory research team.
  • Winbond DRAM revenue forecastNT$156bn in 2026, NT$239bn in 2027The report expects DRAM bit shipments and bit ASP to roughly double and triple, respectively, in 2026, with a further 20-30% increase in 2027.
  • DRAM revenue/gross profit contribution60%/66% in 2027DRAM is expected to become the company's main source of revenue and gross profit.
  • 2026E/2027E EPSNT$25.4/NT$43.2Raised 16%/55% versus prior forecasts and 38%/45% above Bloomberg consensus.
  • NOR flash market share23% in 2025The report states that Winbond is No.1 globally in NOR flash.
  • SLC NAND market share15% in 2025The report states that Winbond is No.3 globally and aims to become No.1.
  • flash revenue CAGR99% in 2025-2027Flash is expected to account for about 30% of revenue in both 2026 and 2027.

Impact & implications

If the report's view plays out, Winbond's investment thesis would shift from a simple cyclical rebound to higher-visibility earnings expansion: DRAM would benefit from DDR4 supply contraction, server demand, and LTA protection, while the flash business would benefit from leadership in NOR, rising SLC NAND share, and supply exits. The target price increase reflects that the market may not yet fully price in EPS upside for 2026-2027.

Risks

  • Traditional consumer DRAM contract price and demand trends in 4Q25-2Q26 are weaker than expected.
  • SLC NAND and NOR flash price and demand trends are weaker than expected.
  • CUBE business ramp-up progress is slower than expected.
  • If execution of new capacity, new products, and LTAs falls short of expectations, revenue and profit expansion may weaken.

What to watch

  • Shipment mix and customer demand after DDR4 8Gb volume ramps from 3Q26.
  • Whether the DRAM industry supply-demand gap widens as expected in 2026-2028.
  • Order sustainability from CSP customers for DRAM, NOR flash, and SLC NAND.
  • Progress in capacity expansion, market share gains, and gross margin delivery for SLC NAND and NOR flash.
  • Revenue contribution from CUBE edge AI 3D DRAM after 2027.
Zhejiang ICP No. 2022035445-5
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